BTC-700D
Please see PDF SEMI-090 for ordering information.
BTC700D — High Durability — Instrumented Wafer Pair — Max Temp 700 C
The BTC-700D uses the most rugged components possible to increase the lifespan of these fragile products. This assembly will respond to the static and dynamic temperature changes occurring in typical wafer bonding processes.
The BTC700 finds application in wafer bonding equipment where knowing and controlling temperature uniformity across mating silicon wafer surfaces is required. MEMS, MOEMS, silicon-on-insulator (SOI), wafer level packaging, and 3 dimensional chip stacking are the main technical categories where wafer bonding is employed.
Bonded Wafers can be fabricated from any wafer diameter so that a specific bonding process can be followed as close as technically possible. As a user of this product, you can expect rapid, accurate, and reliable response to temperature changes that occur during the wafer bonding processes.
Type K Thermocouple (Chromel/Alumel) — The most popular sensor for use in this design. The Type K thermocouple offers the best balance of range, accuracy, and reliability.
